AA-M
Adipic acid–composite polyamine amine-terminated polyamide-type epoxy curing agent
Balanced pot life / flexibility / adhesion / low-temperature cure
| Product positioning Controlled partial amidation of adipic acid with a composite polyamine yields an amine-terminated polyamide-type epoxy curing agent, designed for a balance of pot life, flexibility, adhesion and low-temperature cure performance. |
| Product information |
Details |
| Brand |
Vanconol |
| Product code |
AA-M |
| English name |
Adipic Acid–Composite Amine Amidoamine Epoxy Curing Agent |
| Manufacturer |
Tianjin Hi-Perferal Advanced Materials Co., Ltd. |
| Document version |
TDS v1.0 · Initial technical release |
| Applicable documents |
Product selection, formulation screening and application discussions; refer to the accompanying SDS for safety information |
1 Product Overview
Controlled partial amidation of adipic acid with a composite polyamine yields an amine-terminated polyamide-type epoxy curing agent, designed for a balance of pot life, flexibility, adhesion and low-temperature cure performance.
2 Key Features
- Amine-terminated polyamide structure, suitable for formulation screening toward flexibility and adhesion.
- Degree of reaction and pot life can be adjusted via the acid/amine active hydrogen equivalent ratio.
- Suitable for compatibility evaluation with standard bisphenol A liquid epoxy resins.
- Application windows can be established around low-temperature cure, post-immersion performance and coating film durability.
3 Product and Composition Information
| Item |
Technical information |
| Product form |
Liquid amine-terminated polyamide epoxy curing agent (specific appearance and viscosity to be confirmed per batch) |
| Chemical type |
Adipic acid-modified amine-terminated polyamide / amidoamine-type curing agent |
| Main reactive components |
Composite polyamine / adipic acid |
| Central screening parameter |
Acid carboxyl / amine active hydrogen equivalent ratio R = 0.75 |
| Parameter status |
AHEW = 85 g/eq is a demonstration input and must be replaced with measured values |
| Data status note This technical data sheet distinguishes “R&D screening starting points, target values and pending measurements” from formal specifications. Unless explicitly stated otherwise, the table contents should not be interpreted as batch release limits or final performance guarantees. |
4 Typical Technical Data (to be established / batch-confirmed)
| Parameter |
Current data status |
Application relevance |
| Appearance, color, odor |
Internal typical values to be established |
Based on test results from representative batches |
| Viscosity |
Internal typical values to be established |
Test temperature and method must be fixed |
| Acid value / amine value / AHEW |
To be measured |
Used to assess the degree of amidation and the final ratio |
| Moisture, insolubles |
To be measured |
Related to storage stability and coating film performance |
5 Recommended Applications
| Application area |
Pairing and points of attention |
Suitable R&D scenario |
| General-purpose epoxy coatings |
Screening in combination with bisphenol A liquid epoxy resins |
Primer, protective coating and repair coating directions |
| Flexible epoxy systems |
Prioritize evaluation of bending, impact and adhesion |
For coating directions requiring a certain degree of toughness |
| Long pot-life systems |
Increase the R value together with temperature/ratio optimization |
Low-temperature cure speed must also be monitored |
6 Suggested Starting Use Window
The parameters below are intended for laboratory formulation screening and establishment of application windows. Formal recommended values should be corrected according to the target epoxy resin, pigments and fillers, application temperature, substrate and test results.
| Screening item |
Suggested starting point / window |
Notes |
| Curing agent / epoxy resin |
45 / 55 / 65 phr |
For screening gel time, hardness and pot life |
| Cure temperature |
5 / 10 / 25 °C |
Low-temperature cure versus ambient-temperature cure |
| Acid/amine active hydrogen equivalent ratio R |
0.70 / 0.75 / 0.80 |
Central sample R = 0.75; final value corrected against acid value, amine value and AHEW |
| Amidation screening window |
Approx. 150–180 °C |
In the first round, exceeding 200 °C is not recommended, to prevent branching and localized gelling |
7 Suggested Evaluation Parameters
- Gel time / tack-free time
- Pot life
- Hardness at 24 h and 7 d
- Adhesion and flexibility
- Hardness and adhesion after water immersion
- Water absorption, acid and alkali resistance
| Formulation screening recommendations Parallel evaluations should be carried out using the same batch of bisphenol A liquid epoxy resin, recording curing agent/resin ratio, ambient temperature, humidity, film thickness, substrate preparation, gel time, hardness and adhesion at the same time, so that product performance is not judged on a single indicator alone. |
8 Handling and Use Recommendations
- Before use, confirm the curing agent’s appearance, uniformity, batch number and storage condition; if necessary, first run a small-sample compatibility test.
- Epoxy resin and curing agent should be proportioned according to the equivalent relationship and the measured AHEW; do not rely on mass ratio alone for long-term use.
- Before application, evaluate mixed viscosity, pot life, substrate moisture content, ambient temperature and humidity, and film-forming conditions.
- For waterborne systems, pay particular attention to post-mixing stability, pH, separation/surface oil, drying speed and water resistance.
9 Packaging and Technical Service
| Item |
Information |
| Packaging specification |
Confirmed according to the actual supply batch and customer requirements |
| Storage conditions |
Follow the official label and SDS requirements; confirm the batch storage condition before use |
| Technical support |
Support available for formulation screening, cure condition optimization and application performance evaluation |
| Related documents |
SDS, COA and batch inspection reports are provided as controlled versions |
| Disclaimer This TDS is intended for product technical communication and formulation screening. Actual results depend on resin type, formulation composition, substrate, application and cure conditions; formal specifications, batch quality and regulatory information are governed by the controlled versions of the TDS, COA and SDS. |
Source: internal company document “AA-M Adipic Acid–Polyamine Amine-Terminated Polyamide Epoxy Curing Agent Formulation Table” and process validation documentation for three epoxy curing agents (2026-11).
Tianjin Hi-Perferal Advanced Materials Co., Ltd. · Vanconol
