CM-PF-M
Cardanol–paraformaldehyde–composite amine Mannich epoxy curing agent
Fast cure at low temperature / on damp substrates · Balanced flexibility and water resistance
| Product positioning For epoxy curing applications under low-temperature or damp-substrate conditions, the cardanol-modified Mannich structure is used to balance cure speed, flexibility, adhesion and cost. |
| Product information |
Details |
| Brand |
Vanconol |
| Product code |
CM-PF-M |
| English name |
Cardanol–Paraformaldehyde–Composite Amine Mannich Epoxy Curing Agent |
| Manufacturer |
Tianjin Hi-Perferal Advanced Materials Co., Ltd. |
| Document version |
TDS v1.0 · First release of technical data |
| Applicable documents |
Product selection, formulation screening and application discussions; for safety information refer to the accompanying SDS |
1 Product Overview
For epoxy curing applications under low-temperature or damp-substrate conditions, the cardanol-modified Mannich structure is used to balance cure speed, flexibility, adhesion and cost.
2 Key Features
- Cardanol-modified Mannich structure that balances reactivity and flexibility.
- Developed and screened for application windows at low temperature and on damp substrates.
- Suitable for screening in combination with standard bisphenol A liquid epoxy resins.
- Cure speed, viscosity and pot life can be adjusted via the formaldehyde level and the amine/cardanol ratio.
3 Product and Composition Information
| Item |
Technical information |
| Product form |
Liquid modified amine epoxy curing agent (specific appearance and viscosity to be confirmed per batch) |
| Chemical type |
Cardanol-modified Mannich epoxy curing agent |
| Main reactive components |
Composite heavy amine / cardanol / paraformaldehyde |
| Typical R&D ratio |
Composite heavy amine 650 g / cardanol 180 g / 95% paraformaldehyde 66 g |
| R&D ratio status |
Centre-point formulation from laboratory screening; not equivalent to the final production formulation |
| Notes on data status This document distinguishes R&D screening starting points, target values and values pending measurement from formal specifications. Unless expressly stated otherwise, the values in the tables should not be interpreted as batch release limits or as guarantees of final performance. |
4 Typical Technical Data (to be established / confirmed per batch)
| Parameter |
Current data status |
Relevance to application |
| Appearance, colour, odour |
Internal typical values to be established |
To be based on test results from representative batches |
| Viscosity |
Internal typical values to be established |
Test temperature and method must be kept constant |
| Amine value / AHEW |
To be measured |
Final formulation ratios should preferably use the measured AHEW |
| Water content, free formaldehyde, insolubles |
To be measured |
Used for batch consistency and application risk control |
5 Recommended Applications
| Application |
Formulation partners and key considerations |
Suitable R&D scenarios |
| Two-component epoxy coatings |
Screening in combination with bisphenol A liquid epoxy resins |
Low-temperature application, general protective coatings, primers/repair |
| Application on damp substrates |
To be confirmed by tests on substrate moisture content and interfacial adhesion |
Epoxy repair and maintenance in damp environments |
| Flexible epoxy systems |
Adjusted via curing agent dosage and modification ratio |
Focus on impact, bending and adhesion after water immersion |
6 Suggested Starting Use Window
The following parameters are intended for laboratory formulation screening and for establishing an application window. Final recommended values should be corrected according to the target epoxy resin, pigments and fillers, application temperature, substrate and test results.
| Screening item |
Suggested starting point / window |
Notes |
| Curing agent / epoxy resin |
45 / 55 / 65 phr |
Used to screen gel time, hardness and pot life |
| Cure temperature |
5 / 10 / 25 °C |
Screening of the low-temperature cure window |
| Hold reaction screening window |
75–85 °C, 2–4 h |
This is a preparation screening window, not a release process |
| Feed pre-mixing window |
50–70 °C |
Paraformaldehyde should be added in portions with controlled heat evolution |
7 Suggested Evaluation Items
- Gel time / tack-free time
- Hardness at 24 h and 7 d
- Pot life
- Adhesion
- Hardness and adhesion after water immersion
- Water absorption, acid and alkali resistance
| Formulation screening note Parallel evaluations should be carried out with the same batch of bisphenol A liquid epoxy resin, recording the curing agent/resin ratio, ambient temperature, humidity, film thickness, substrate preparation, gel time, hardness and adhesion, so that product performance is not judged on a single parameter alone. |
8 Handling and Use Recommendations
- Before use, check the appearance, uniformity, batch number and storage condition of the curing agent; if necessary, first run a small-scale compatibility test.
- The epoxy resin and curing agent should be proportioned according to the equivalent relationship and the measured AHEW; do not rely on the mass ratio alone for long-term use.
- Before application, assess the mixed viscosity, pot life, substrate moisture content, ambient temperature and humidity, and film formation conditions.
- For waterborne systems, pay particular attention to stability after mixing, pH, separation/surface oil, drying speed and water resistance.
9 Packaging and Technical Service
| Item |
Information |
| Packaging |
To be confirmed according to the actual supply batch and customer requirements |
| Storage conditions |
Follow the requirements of the official label and SDS; confirm the storage condition of the batch before use |
| Technical support |
Support available for formulation screening, cure condition optimisation and application performance evaluation |
| Related documents |
SDS, COA and batch inspection reports are provided in controlled versions |
| Disclaimer This TDS is intended for technical communication and formulation screening. Actual results depend on the resin type, formulation composition, substrate, application and cure conditions; formal specifications, batch quality and regulatory information are governed by the controlled versions of the TDS, COA and SDS. |
Source: internal company document “CM-PF-M Cardanol–Heavy Amine Mannich Epoxy Curing Agent Formulation Table” and process validation data for three epoxy curing agents (2026-11).
Tianjin Hi-Perferal Advanced Materials Co., Ltd. · Vanconol
